How to Install an RP2040 Modchip on a Nintendo Switch Lite
A complete installation walkthrough covering disassembly, SoC ribbon cable placement, DAT0/CMD/CLK/RST wiring, 3.3V and GND points, IHS modification, testing, and troubleshooting.
Disclaimer
Modifying your Nintendo Switch Lite may permanently damage the console if performed incorrectly, and will void Nintendo’s warranty. This guide is for educational purposes only. If you’re not confident in your microsoldering ability, seek a professional technician.
Introduction
Unlike unpatched Switch consoles that use the RCM fusee-gelee exploit, modchips enable custom firmware on all Switch models — including fully patched units — by performing CPU voltage glitching to bypass bootROM firmware verification. When glitching succeeds, the chip launches a payload.bin file from your microSD card in place of Nintendo’s normal boot process.
The only community-supported RP2040 modchip is Picofly (which includes pre-made variants as well as DIY builds using an RP2040-Tiny development board). “HWFLY” and “SX Core/Lite” chips exist but are not covered here.
One important note before you begin: the Switch Lite requires a microSD card to be inserted at all times once modded. Without one, the console will be unusable unless your chip’s firmware supports bypassing sdloader (e.g., Picofly firmware does support this via holding a volume button at power-on).
Tools & Materials Required
Soldering Iron
Temperature-controlled, small tip, capable of reaching 350°C consistently.
Quality Flux
Essential for clean solder flow on fine pads. Don't skip this.
34–38 AWG Wire
Single-core Kynar wire recommended. Thinner is better for routing.
Screwdriver Bits
+00 Phillips and Y1.5 tri-point for the Switch Lite chassis.
Isopropyl Alcohol
95–99% IPA to clean thermal paste off the SoC before soldering.
Thermal Paste
Non-conductive. Reapply to the SoC die during reassembly.
Soldering Tin
Leaded solder recommended; unleaded works at higher skill levels.
Kapton Tape
Optional but recommended to protect solder joints from thermal paste.
Double-Sided Tape
For securing the modchip to the IHS after installation.
Microscope
Optional but strongly recommended for inspecting SoC ribbon joints.
UV Solder Mask
Optional. Helps protect fragile points like CLK from future damage.
Toothpicks / Q-Tips
For removing thermal paste from between the SoC capacitors.
STEP 01
Disassemble the Nintendo Switch Lite
- Remove the rear shell screws and lift off the backplate.
- Remove the metal shield/cover beneath the backplate.
- Disconnect the battery connector before touching anything else on the board.
- Remove the heatpipe and heatsink assembly.
- Remove the IHS (Internal Heat Spreader) to expose the bare Tegra X1 SoC die and RAM chips underneath.
- Clean all thermal paste off the SoC die and from between the capacitors on the SoC using 95–99% IPA. The red-ish thermal goop between the heatpipe and metal shield can be left alone.